During the inspection of the quality of the SMT patch, it was found that there was some solder paste on the surface, and it was known that it was misprinted. In order not to affect the overall patch effect, these misprinted solder pastes need to be cleaned up. Is there any feasible way for us to share with us?

If you use the most traditional method, that is, using a small spatula to remove the solder paste from the misprinted board, it may cause some problems. Therefore, we do not recommend this method. The current use of the production process should be more than this, that is, the misprinted SMT board is immersed in a compatible solvent, after a period of soaking, it can be used with a soft brush. Small tin beads are removed from the board.

If the solder paste is more stubborn, it can be immersed and washed several times repeatedly, but be careful not to dry the brush or shovel too much, which will also have an adverse effect on the SMT patch products. Since the longer the operator waits for the misprinting after the solder paste is printed, the harder it is to remove the solder paste, so if the problem is found, it should be placed in the soaking solvent immediately, without delay.

One more thing to remind everyone is to avoid wiping the SMT patch with a cloth strip to prevent solder paste and other contaminants from sticking to the surface of the board. In general, a gentle spray after immersion can help remove excess solder paste. In addition to the above methods, it is recommended that you use hot air drying technology, or solder paste can be detached from the component to restore a good surface.